US Patent Issued to TOKYO OHKA KOGYO on May 26 for "Rinsing solution, method of treating substrate, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,638, issued on May 26, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kanagawa, Japan).

"Rinsing solution, method of treating substrate, and method of manufacturing semiconductor device" was invented by Yukihisa Wada (Kanagawa, Japan), Natsumi Okawa (Kanagawa, Japan), Satoshi Fujimura (Kanagawa, Japan), Takayuki Haraguchi (Kanagawa, Japan) and Kazumasa Wakiya (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A rinsing solution for rinsing a substrate with a protrusion portion, including an organic solvent (S1) that contains no hydroxyl group or fluorine atom and that has a dynamic viscosity of equal to or smaller than 1.05x106 m2/s. A metho...