US Patent Issued to TOKYO OHKA KOGYO on March 31 for "Method for processing substrate, chemical solution, and method for providing chemical solution" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,639, issued on March 31, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kanagawa, Japan).

"Method for processing substrate, chemical solution, and method for providing chemical solution" was invented by Takumi Namiki (Kanagawa, Japan), Kazumasa Wakiya (Kanagawa, Japan) and Yukihisa Wada (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for processing a substrate, for processing a surface of a substrate having projections/depressions formed on the surface, the method having: a rinsing step S101 of rinsing the surface of the substrate with a rinsing solution containing water; a chemical solution replacement step S102 of bringing a ...