US Patent Issued to TOKYO OHKA KOGYO on March 17 for "Protective film forming agent, and method for producing semiconductor chip" (Japanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,886, issued on March 17, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kawasaki, Japan).

"Protective film forming agent, and method for producing semiconductor chip" was invented by Tetsuro Kinoshita (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A protective film forming agent that, in dicing of a semiconductor wafer, is used to form a protective film on the surface of the semiconductor wafer, can form a protective film that has excellent laser processability, and has excellent solubility of a light-absorbing agent; and a method for producing a semiconductor chip using the protective film forming agent. The protective film forming ag...