US Patent Issued to TOKYO INSTITUTE OF TECHNOLOGY, ADVANTEST on March 3 for "Semiconductor device having wiring part without being exposed from substrate" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,833, issued on March 3, was assigned to TOKYO INSTITUTE OF TECHNOLOGY (Tokyo) and ADVANTEST Corp. (Tokyo).

"Semiconductor device having wiring part without being exposed from substrate" was invented by Takayuki Ohba (Tokyo) and Shinji Sugatani (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a power supply and ground layer and a semiconductor chip disposed over the power supply and ground layer. The power supply and ground layer includes a substrate and a wiring part. The substrate has one or more grooves whose openings are directed toward the semiconductor chip, and the wiring part is disposed within th...