US Patent Issued to Tokyo Electron on Sept. 8 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,418, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Hayato Tanoue (Kikuchi-gun, Japan) and Yohei Yamashita (Kikuchi-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method of a combined substrate in which a first substrate and a second substrate are bonded to each other is provided. A laser absorption layer is formed on the second substrate. The substrate processing method includes forming a separation modification layer by radiating a laser beam to the laser absorption layer in a pulse shape to accumulate a stress in the...