US Patent Issued to Tokyo Electron on Oct. 27 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,878, issued on Oct. 27, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Tsunenaga Nakashima (Koshi City, Japan) and Hiroaki Inadomi (Koshi City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a liquid processing apparatus configured to form a liquid film on a surface of a substrate; a supercritical drying apparatus configured to dry the substrate by replacing the liquid film with a supercritical fluid; a first load-lock apparatus configured to switch an atmosphere around the substrate from a first one of a normal pressure atm...