US Patent Issued to Tokyo Electron on Nov. 3 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,726, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Yasutaka Mizomoto (Kikuchi-gun, Japan) and Yohei Yamashita (Kikuchi-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other is provided. A device layer including multiple devices is formed on a front surface side of the first substrate. The substrate processing method includes forming a light leakage prevention layer by radiating first laser light to an oxygen-cont...