ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,785,037, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo).

"Passivation equipment and passivation method for semiconductor device" was invented by Chi-Wen Chen (Hsinchu City, Taiwan), Chun-Huai Li (Hsinchu City, Taiwan), Chih-Hung Chen (Hsinchu City, Taiwan) and Chun-Hung Hung (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A passivation equipment includes a chamber housing and a splitter disposed in the chamber housing. The splitter divides the chamber housing into a first chamber and a second chamber, where the second chamber accommodates a semiconductor device. The passivation equipment further includes a first intake...