US Patent Issued to Tokyo Electron on May 5 for "Deposition method and deposition apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,618,148, issued on May 5, was assigned to Tokyo Electron Ltd. (Tokyo).

"Deposition method and deposition apparatus" was invented by Muneyuki Otani (Tokyo) and Akira Matsubara (Iwate, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A deposition method includes: (a) preparing a substrate with a recess on a surface thereof; (b) supplying an organic raw material gas to the surface to adsorb the organic raw material gas to the recess; (c) supplying an oxygen-containing gas to the surface to oxidize the organic raw material gas adsorbed to the recess; and (d) after the (c), supplying a first gas containing a dehydrating agent to the surface."

The patent w...