ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,753, issued on May 26, was assigned to Tokyo Electron Ltd. (Tokyo).

"Grinding apparatus" was invented by Takayoshi Wakamatsu (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A grinding apparatus includes a rotary table, multiple chuck, a rotational driving unit, a grinding position cover, a cleaning unit and an attachment/detachment position cover. The horizontal rotary table is configured to be rotated around a vertical rotation center line. The multiple chucks are arranged at an equal distance therebetween around the rotation center line of the rotary table. The rotational driving unit moves the chuck between an attachment/detachment...