US Patent Issued to Tokyo Electron on May 12 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,623,313, issued on May 12, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Yohei Yamawaki (Kumamoto, Japan), Seiji Nakano (Kumamoto, Japan), Yoshihiro Kawaguchi (Kumamoto, Japan) and Munehisa Kodama (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a chuck configured to hold a substrate horizontally; a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate; and a lower cup configured to collect a processing residue falling from the substr...