ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,410, issued on March 31, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film forming method and film forming apparatus" was invented by Zeyuan Ni (Nirasaki, Japan) and Taiki Kato (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method includes preparing a substrate having a first region in which a metal film or an oxide film of the metal film is exposed, and a second region in which an insulating film is exposed, supplying, to the substrate, an organic compound containing, in a head group, a triple bond between carbon atoms represented by Chemical Formula (1) described in the specification, causing the organic compound ...