ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,793, issued on March 3, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate processing apparatus, substrate processing method, and storage medium thereof" was invented by Youngtai Kang (Yamanashi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a substrate transfer controller that determines a placement condition of the substrate holder and a substrate placement position on the substrate holder based on a model, a substrate transfer position setting value, and a substrate holder setting value from the film thickness measurement result, and operates the substrate transfer device; an eccentricity sta...