ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,017, issued on March 17, was assigned to Tokyo Electron Ltd. (Tokyo).
"Bonding layer and process" was invented by Scott Lefevre (Albany, N.Y.), Adam Gildea (Albany, N.Y.), Satohiko Hoshino (Koshi, Japan), Sophia Madelone (Albany, N.Y.) and Yuji Mimura (Koshi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes providing a first substrate with a first surface including an alkyne moiety. The method includes providing a second substrate with a second surface including an azide moiety. The method further includes bonding the first substrate to the second substrate. The bonding of the first substrate to the second substrate includes m...