US Patent Issued to Tokyo Electron on June 23 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,734, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Kiyoshi Mori (Fuchu City, Japan) and Haruhiko Furuya (Nirasaki City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes: exhausting a first space in a processing container by an exhaust mechanism, which is configured to exhaust the first space via a gap by exhausting a second space in the processing container, or configured to exhaust the first space in a state in which a seal gas is caused to flow from the second space to the first space via the gap; and execut...