US Patent Issued to Tokyo Electron on July 21 for "Bonding energy measurement" (New York Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,485, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo).

"Bonding energy measurement" was invented by Andrew Tuchman (Albany, N.Y.) and Ilseok Son (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of determining a bonding energy of a bonded wafer includes receiving the bonded wafer including a first wafer bonded with a second wafer, and inserting a blade between the first wafer and the second wafer to form a crack between the first wafer and the second wafer, the crack extending from a portion of the blade contacting the first wafer and the second wafer to a point where the first wafer and the second wafer are still b...