US Patent Issued to Tokyo Electron on July 15 for "Film deposition apparatus and film deposition method" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,302, issued on July 15, was assigned to Tokyo Electron Ltd. (Tokyo).

"Film deposition apparatus and film deposition method" was invented by Manabu Honma (Iwate, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film deposition apparatus includes a vacuum chamber, a rotary table in the vacuum chamber, and configured to mount multiple substrates along a circumferential direction, a first processing region, a separation region, and a second processing region provided in this order from an upstream side to a downstream side in a rotation direction of the rotary table. A separation gas supply and a third exhaust port are provided in the separation r...