US Patent Issued to Tokyo Electron on July 14 for "Substrate liquid processing method and substrate liquid processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,169, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate liquid processing method and substrate liquid processing apparatus" was invented by Mitsuaki Iwashita (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique of improving an adhesion between a metal precipitated in a recess of a substrate and a surface partitioning the recess in an electroless plating processing in which a plated metal is deposited from the bottom of the recess is provided. A substrate liquid processing method includes preparing a substrate including a recess and a wiring exposed at a bottom of the recess; forming a self-assembled mon...