US Patent Issued to Tokyo Electron on Jan. 27 for "Bonding apparatus, bonding system, bonding method, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,829, issued on Jan. 27, was assigned to Tokyo Electron Ltd. (Tokyo).

"Bonding apparatus, bonding system, bonding method, and recording medium" was invented by Takashi Nakamitsu (Koshi, Japan), Shuhei Matsumoto (Koshi, Japan) and Yosuke Omori (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface there...