US Patent Issued to Tokyo Electron on Jan. 20 for "Thickness measuring device and thickness measuring method to measure thickness of substrate" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,556, issued on Jan. 20, was assigned to Tokyo Electron Ltd. (Tokyo).

"Thickness measuring device and thickness measuring method to measure thickness of substrate" was invented by Takeshi Tamura (Kumamoto, Japan), Munehisa Kodama (Kumamoto, Japan) and Tomohiro Kaneko (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thickness measuring device configured to measure a thickness of a substrate includes a substrate holder configured to hold the substrate; a measurer configured to measure the thickness of the substrate held by the substrate holder; and a moving mechanism configured to move the substrate holder and the measurer relatively i...