US Patent Issued to Tokyo Electron on Jan. 20 for "Substrate treatment system and substrate treatment method" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,968, issued on Jan. 20, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate treatment system and substrate treatment method" was invented by Keiichi Yahata (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treatment system connected to an exposure apparatus, includes: a substrate treatment apparatus configured to perform a treatment on a substrate; and a supply apparatus configured to supply atmosphere gas during a substrate treatment to the substrate treatment apparatus, wherein: the supply apparatus includes an intake part configured to take in emission gas emitted from the exposure apparatus; and the supply apparatus re...