US Patent Issued to Tokyo Electron on Jan. 20 for "Substrate processing apparatus and cleaning method" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,219, issued on Jan. 20, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and cleaning method" was invented by Masato Shinada (Tokyo) and Yusuke Kikuchi (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate processing apparatus comprising a processing chamber, a rotatable substrate support configured to hold a substrate in the processing chamber, a freezing device that is in contact with or separated from the substrate support and is configured to cool the substrate support, a mechanism configured to rotate the substrate support and raise and lower the freezing device, a power supply part...