ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,683, issued on Jan. 20, was assigned to Tokyo Electron Ltd. (Tokyo).
"Apparatus for substrate processing" was invented by Masahiro Tabata (Miyagi, Japan), Toru Hisamatsu (Miyagi, Japan), Sho Kumakura (Miyagi, Japan), Ryuichi Asako (Miyagi, Japan), Shinya Ishikawa (Miyagi, Japan) and Masanobu Honda (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a substrate is provided. The substrate includes an etching target region and a patterned region. The patterned region is provided on the etching target region. In the method, an organic film is formed on a surface of the substrate. Subsequently, the etching target region i...