ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,369, issued on Feb. 3, was assigned to Tokyo Electron Ltd. (Tokyo).
"Transistor stacking by wafer bonding" was invented by Mark I. Gardner (Cedar Creek, Texas) and H. Jim Fulford (Marianna, Fla.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device includes receiving a first wafer including a first substrate on a backside of the first wafer, and a first semiconductor-on-insulator (SOI) stack on a front side of the first wafer. The first SOI stack includes a first semiconductor. A second wafer is received that includes a second substrate on a backside of the second wafer, and a second SOI stack on a front side o...