US Patent Issued to Tokyo Electron on Feb. 24 for "Film forming apparatus and film forming method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,835, issued on Feb. 24, was assigned to Tokyo Electron Ltd. (Tokyo).

"Film forming apparatus and film forming method" was invented by Koji Maeda (Nirasaki, Japan), Atsushi Shimada (Nirasaki, Japan), Katsushi Oikawa (Nirasaki, Japan) and Tetsuya Miyashita (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming apparatus includes a processing container, a substrate holder configured to hold a substrate inside the processing container, a cathode unit disposed above the substrate holder, and a gas introducing mechanism configured to introduce a plasma generating gas into the processing container. The cathode unit includes a target...