ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,205, issued on Feb. 17, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate treatment system and substrate treatment method" was invented by Masashi Tsuchiyama (Koshi, Japan) and Taro Yamamoto (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treatment system includes a wet system, a dry system, and a relay transfer system. The wet system has a wet treatment apparatus which performs in a wet mode one of substrate treatments from a formation treatment of a resist film to a developing treatment of the resist film after exposure, and is coupled to an exposure apparatus. The dry system has a dry treatment apparatus which perfo...