US Patent Issued to Tokyo Electron on Feb. 17 for "Processing apparatus and substrate transfer method with first and second suction paths" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,592, issued on Feb. 17, was assigned to Tokyo Electron Ltd. (Tokyo).

"Processing apparatus and substrate transfer method with first and second suction paths" was invented by Tadashi Obikane (Yamanashi, Japan), Fumito Kagami (Yamanashi, Japan) and Kaori Arai (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A processing apparatus includes a pick configured to hold and transfer a substrate, a first suction pad disposed at a position in the pick where the first suction pad comes into contact with a concavely curved substrate, a second suction pad disposed at a position in the pick where the second suction pad comes into contact with a co...