ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,753, issued on Feb. 17, was assigned to Tokyo Electron Ltd. (Tokyo).
"Apparatus for plasma processing and plasma processing system" was invented by Shingo Kitamura (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for plasma processing comprises: a support configured to support a substrate and an edge ring disposed around the substrate; a lifting mechanism configured to vertically move the edge ring; and a controller. The support includes a convex portion which protrudes upward and on which the substrate is mounted, a ring mounting portion on which the edge ring is mounted in a state in which the convex portion is inserted i...