US Patent Issued to Tokyo Electron on Feb. 10 for "Substrate transfer device and power supply method for substrate transfer device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,668, issued on Feb. 10, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate transfer device and power supply method for substrate transfer device" was invented by Lingxin Jiang (Yamanashi, Japan) and Tsukasa Chida (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate transfer device comprising: a tile part forming a moving surface of an area where a substrate is transferred and provided with a plurality of first coils that generate magnetic field on the moving surface by a power supplied from a power supply part; and a substrate transfer module including a plurality of magnets that exert a repulsive force again...