US Patent Issued to Tokyo Electron on Feb. 10 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,659, issued on Feb. 10, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Toru Ihara (Koshi, Japan), Satoru Tanaka (Koshi, Japan), Gentaro Goshi (Koshi, Japan), Masami Yamashita (Koshi, Japan), Reijiro Yamanaka (Tokyo) and Hideaki Kumashiro (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus configured to dry a substrate with a processing fluid in a supercritical state includes: a processing vessel; a substrate holder configured to hold the substrate horizontally within the processing vessel; a first supply line connected to a first ...