US Patent Issued to Tokyo Electron on Feb. 10 for "Substrate processing apparatus and substrate processing method" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,076, issued on Feb. 10, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Koichi Matsunaga (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a hydrophobizing part configured to perform a hydrophobizing process of forming a hydrophobic film on a front surface of a substrate through vapor deposition of a hydrophobizing gas, an ultraviolet radiation part configured to radiate ultraviolet rays to a removal area on a rear surface of the substrate so as to remove the hydrophobic film formed in the removal area in the hydrophobiz...