ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,356, issued on Dec. 30, was assigned to Tokyo Electron Ltd. (Tokyo).
"Apparatus and method for wafer alignment" was invented by David Power (Albany, N.Y.), David Conklin (Albany, N.Y.), Anthony Schepis (Albany, N.Y.), Andrew Weloth (Albany, N.Y.) and Anton Devilliers (Albany, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes providing a carrier substrate having a die bonded thereto, where the die includes a first alignment mark on a first surface. The method includes positioning a target substrate with a second surface on a substrate stage, where the target substrate includes a second alignment mark on the second surface. The met...