US Patent Issued to Tokyo Electron on Dec. 23 for "Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer" (New York Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,019, issued on Dec. 23, was assigned to Tokyo Electron Ltd. (Tokyo).

"Wafer chuck designs and methods for retaining a processing liquid on a surface of a semiconductor wafer" was invented by Ronald Nasman (Albany, N.Y.), Peter D'Elia (Albany, N.Y.), Shan Hu (Albany, N.Y.), James Grootegoed (Albany, N.Y.), Rodney Robison (Albany, N.Y.) and Anton Devilliers (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Improved wafer chuck designs and methods are provided herein for retaining a processing liquid on a surface of a semiconductor substrate during a puddle process. More specifically, the present disclosure provides various embodiments of wa...