ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,565, issued on Dec. 2, was assigned to Tokyo Electron Ltd. (Tokyo).
"Sputtering apparatus and control method" was invented by Shota Ishibashi (Nirasaki, Japan) and Toru Kitada (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sputtering apparatus includes: a processing container; a first target provided inside the processing container and formed of a first material; a second target provided inside the processing container and formed of a second material different from the first material; a stage provided inside the processing container to place a substrate thereon: a shielding plate arranged between the first target and the second tar...