ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,486,570, issued on Dec. 2, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film forming method and film forming apparatus" was invented by Takashi Matsumoto (Nirasaki, Japan) and Ryota Ifuku (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method includes a first step of supplying a first aromatic hydrocarbon gas having a first functional group to a substrate provided with an underlayer film, and a second step of activating the first aromatic hydrocarbon gas adsorbed on a surface of the underlayer film by plasma of a first reaction gas that contains at least a rare gas."
The patent was filed on June 11, 2021, under Applicatio...