US Patent Issued to Tokyo Electron on Aug. 11 for "Substrate processing system, aligning apparatus, and substrate shape monitoring method including speed and/or acceleration decreasing protocol" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,583, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing system, aligning apparatus, and substrate shape monitoring method including speed and/or acceleration decreasing protocol" was invented by Kento Tokairin (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes a stage on which a substrate is to be placed, a rotation mechanism unit configured to rotate the stage, a sensor configured to detect an outline position of the substrate while the substrate is rotated, and a control device. The control device performs control of: (a) rotating the stage at a first speed and a ...