US Patent Issued to TOKUYAMA on Oct. 27 for "Packaging bag for filling crushed polysilicon material and polysilicon package" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,146, issued on Oct. 27, was assigned to TOKUYAMA Corp. (Yamaguchi, Japan).

"Packaging bag for filling crushed polysilicon material and polysilicon package" was invented by Takuya Asano (Yamaguchi, Japan), Takuya Yokose (Yamaguchi, Japan) and Toru Onoda (Yamaguchi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging bag according to the present invention for packing a crushed polysilicon material is a packaging bag (1) for directly packaging a crushed polysilicon material and includes a multi-layer film in which an additive-free polyethylene-based resin layer (2) is disposed in an innermost layer, and, on the polyethylene-based resin lay...