US Patent Issued to TOKUYAMA on March 17 for "Method for producing semiconductor treatment liquid and method for producing semiconductor element" (Japanese Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,465, issued on March 17, was assigned to TOKUYAMA Corp. (Yamaguchi, Japan).

"Method for producing semiconductor treatment liquid and method for producing semiconductor element" was invented by Kohei Saito (Yamaguchi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a semiconductor treatment liquid used for treating a resin having an ether bond, the method comprising: heating a phosphoric acid-containing solution to 100deg C. or higher and 400deg C. or lower to produce a heated solution; cooling the heated solution to 5deg C. or higher and 95deg C. or lower to produce a cooled solution; and mixing the cooled solution with ...