US Patent Issued to TOHOKU UNIVERSITY on May 12 for "Lambda-Ti 3 O 5 film forming substrate and method for producing Lambda-Ti 3 O 5 film forming substrate" (Japanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,439, issued on May 12, was assigned to TOHOKU UNIVERSITY (Sendai, Japan).

"Lambda-Ti 3 O 5 film forming substrate and method for producing Lambda-Ti 3 O 5 film forming substrate" was invented by Kohei Yoshimatsu (Sendai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A Lambda-Ti3O5 film forming substrate includes a support substrate and a Lambda-Ti3O5 film formed directly on the support substrate."

The patent was filed on Sept. 6, 2022, under Application No. 18/688,977.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch...