US Patent Issued to TOHOKU UNIVERSITY on Aug. 25 for "Co-based superelastic alloy materials, plate materials and wire materials comprising Co-based superelastic alloy materials, Co-based superelastic alloy materials manufacturing methods, stents, guide wires, and hip implants" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,116, issued on Aug. 25, was assigned to TOHOKU UNIVERSITY (Sendai, Japan).

"Co-based superelastic alloy materials, plate materials and wire materials comprising Co-based superelastic alloy materials, Co-based superelastic alloy materials manufacturing methods, stents, guide wires, and hip implants" was invented by Ryosuke Kainuma (Sendai, Japan), Toshihiro Omori (Sendai, Japan), Xiao Xu (Sendai, Japan) and Takumi Odaira (Sendai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A Co-based superelastic alloy material contains a Co-Cr-Al-Si-based alloy and has a composition (at. %) within a pentagon area on the Co-Cr-(Al,Si) pseudo-ternary phase di...