US Patent Issued to TOAGOSEI on May 26 for "Resin composition, layered body including resin composition layer, layered body, flexible copper-clad laminate, flexible flat cable, and electromagnetic wave shielding film" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,637,565, issued on May 26, was assigned to TOAGOSEI Co. LTD. (Tokyo).

"Resin composition, layered body including resin composition layer, layered body, flexible copper-clad laminate, flexible flat cable, and electromagnetic wave shielding film" was invented by Masahiro Torii (Nagoya, Japan), Yuya Okimura (Nagoya, Japan), Hironori Kutsuna (Nagoya, Japan), Makoto Hirakawa (Nagoya, Japan) and Masashi Yamada (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition including a polyester polyurethane resin (A); and an epoxy resin (B), in which a molecular weight per a urethane bond of the polyester polyurethane resin (A) is from 200 to...