US Patent Issued to Thermal Solution Technology on Aug. 18 for "Apparatus for testing semiconductor device test" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,470, issued on Aug. 18, was assigned to Thermal Solution Technology Co. Ltd. (Tokyo).

"Apparatus for testing semiconductor device test" was invented by Byeong-gyu Choi (Seoul, South Korea) and Shunichi Muto (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for testing semiconductor device according to one embodiment comprises: a thermoelement module having both-side surfaces converted into heating surfaces or cooling surfaces according to the direction of a current; a cooling module, which is arranged on the thermoelement module and cools a thermoelement; a pusher module which is arranged under the thermoelement module,...