US Patent Issued to THE UNIVERSITY OF HONG KONG on Sept. 29 for "Cu-Cu direct welding for packaging application in semiconductor industry" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,311, issued on Sept. 29, was assigned to THE UNIVERSITY OF HONG KONG (Hong Kong).

"Cu-Cu direct welding for packaging application in semiconductor industry" was invented by Mingxin Huang (Hong Kong, Hong Kong) and Shien Ping Feng (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a method of bonding two copper structures involving compressing a first copper structure with a second copper structure under a stress from 0.1 MPa to 50 MPa and under a temperature of 250deg C. or less so that a bonding surface of the first copper structure is bonded to the bonding surface of the second copper structure. At least one of the ...