US Patent Issued to The Research Foundation for The State University of New York on April 14 for "High-temperature Cu ink-based conductor with oxidation and corrosion resistance" (New York Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,877, issued on April 14, was assigned to The Research Foundation for The State University of New York (Amherst, N.Y.).

"High-temperature Cu ink-based conductor with oxidation and corrosion resistance" was invented by Shenqiang Ren (Williamsville, N.Y.), Aaron Sheng (Buffalo, N.Y.) and Saurabh Khuje (Amherst, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are conductive slurries with copper nanoplates. The copper nanoplates may be functionalized with formate groups and/or graphene or a graphene material. The slurries may be used as conductive inks, which may be used in 3D printing applications. Also provided are methods of making and u...