ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,651, issued on Feb. 17, was assigned to The Regents of the University of California (Oakland, Calif.), The Board of Trustees of the Leland Stanford Junior University (Stanford, Calif.) and Raytheon Co. (Waltham, Mass.).

"Low-temperature deposition of high-quality aluminum nitride films for heat spreading applications" was invented by Scott Ueda (Whittier, Calif.), Aaron McLeod (La Jolla, Calif.), Andrew Kummel (San Diego), Mike Burkland (Tucson, Ariz.), Eduardo M. Chumbes (Andover, Mass.), Thomas E. Kazior (Arlington, Va.), Eric Pop (Stanford, Calif.), Michelle Chen (Stanford, Calif.), Chris Perez (Stanford, Calif.) and Mark Rodwell (Santa Barbara, Calif.).

According to the abstr...