US Patent Issued to THE INDIUM CORPORATION OF AMERICA on March 24 for "Solder paste on demand apparatus" (North Carolina, Iowa Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,059, issued on March 24, was assigned to THE INDIUM CORPORATION OF AMERICA (Clinton, N.Y.).

"Solder paste on demand apparatus" was invented by Martin Thuo (Apex, N.C.), Ian Tevis (Ames, Iowa) and Darin Heisterkamp (Story City, Iowa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled li...