US Patent Issued to The Hong Kong University of Science and Technology on June 30 for "Miller clamping circuit for driving wide bandgap high voltage power device" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,671,410, issued on June 30, was assigned to The Hong Kong University of Science and Technology (Hong Kong).

"Miller clamping circuit for driving wide bandgap high voltage power device" was invented by Jing Chen (Hong Kong) and Ji Shu (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A Miller clamping circuit for driving a wide bandgap (WBG) device is provided. The Miller clamping circuit comprises: a semiconductor switching device having high side terminal connected to gate of the WBG device; and low side terminal connected to source of the WBG device; a first diode having anode connected to ground terminal of a driver IC chip; and cathode conne...