US Patent Issued to The Hong Kong University of Science and Technology on Feb. 17 for "Automated robotic bedbug eradication device for mattresses" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,550,879, issued on Feb. 17, was assigned to The Hong Kong University of Science and Technology (Hong Kong).

"Automated robotic bedbug eradication device for mattresses" was invented by Guijun Li (Hong Kong), Yang Xu (Hong Kong), Kong Wai Lee (Hong Kong), Haosong Zhong (Hong Kong), Minseong Kim (Hong Kong), Jing Lin (Hong Kong), Wing Yan Poon (Hong Kong), Qiaoyaxiao Yuan (Hong Kong), Huan Liu (Hong Kong) and Yee Him Timothy Chan (Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "An automated dry-heating bedbug eradication device for pest eradication is provided herewith. By the use of a specifically fabricated graphene-coated copper heating film, ...