US Patent Issued to THE CHINESE UNIVERSITY OF HONGKONG, SHENZHEN on Feb. 10 for "Chip embedded composite for electron beam lithography, preparation method and application thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,773, issued on Feb. 10, was assigned to THE CHINESE UNIVERSITY OF HONGKONG, SHENZHEN (Guangdong, China).

"Chip embedded composite for electron beam lithography, preparation method and application thereof" was invented by Zhaoyu Zhang (Guangdong, China), Yaoran Huang (Guangdong, China), Gexing Liu (Guangdong, China) and Haochuan Li (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to the technical filed of semiconductor chip nanofabrication, provides a method for preparing a chip embedded composite for electron beam lithography. The preparation method includes: providing a composite structure, the compos...