US Patent Issued to The Boeing on May 12 for "Wire bundle forming apparatus" (Washington Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,627,124, issued on May 12, was assigned to The Boeing Co. (Arlington, Va.).

"Wire bundle forming apparatus" was invented by Jesse A. Laplante (Monroe, Wash.), Robert T. Johnson (Everett, Wash.), Jin-Seog Seo (Mukilteo, Wash.) and Jacky-Vy C. Chau (Seattle).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire bundle forming apparatus including a wire bundle form board having a plurality of mounting structure couplings, and at least one wire bundle mounting structure configured to couple with the plurality of mounting structure couplings for removably coupling the at least one wire bundle mounting structure to the wire bundle form board in a predetermined ...